The pattern of domestic RF is initially determined.
tech

The pattern of domestic RF is initially determined.

The year 2023 marks the preliminary establishment of the domestic RF front-end chip landscape, with each niche track set to welcome listed companies.Tigers and leopards go their separate ways. In the ...
Storage giants compete for HBM.
tech

Storage giants compete for HBM.

Due to the differences in process, packaging, and demand between processors and memory, the performance gap between the two has been widening since 1980 to the present. Data shows that the speed misma...
Advanced packaging, playing an important role!
tech

Advanced packaging, playing an important role!

As semiconductor front-end nodes become increasingly smaller, the cost of design escalates rapidly. Under these circumstances, advanced packaging and its 2.5D and 3D solutions have become crucial and ...
3D NAND, how can it be played?
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3D NAND, how can it be played?

We have all experienced it: when purchasing Apple phones, the price varies greatly with different memory sizes. This memory refers to flash memory (Flash), and Apple was the first company to use flash...
New wafer factories pouring into Europe.
tech

New wafer factories pouring into Europe.

Recently, according to a report by Taiwanese media citing sources, TSMC's European plant construction schedule will be postponed for two years. The industry therefore speculated that the demand for au...